This inventor holds 1 USPTO granted patent. Top assignee: Qorvo US, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations by Kenneth Frazee in Microelectronics
Introduction
Kenneth Frazee is an accomplished inventor based in Orlando, FL (US). He has made significant contributions to the field of microelectronics, particularly in improving the reliability of solder joints in electronic packages. His innovative work has led to the development of a patented technology that addresses critical issues in microelectronics packaging.
Latest Patents
Kenneth Frazee holds a patent for "Delamination/cracking improvement at solder joints in microelectronics package." This patent focuses on a microelectronics package designed to significantly reduce delamination and cracking at solder joints. The invention includes a carrier, a solder joint region over the carrier, a top intermetallic (IMC) layer, and a device die. The device die consists of a substrate, an active device, a top barrier layer, and a backside metal layer made of gold (Au) with a thickness of at least 0.5 μm. The top IMC layer can comprise gold nickel tin (AuNiSn) or gold platinum tin (AuPtSn), while the solder joint region includes an Au-rich gold-tin (AuSn) and gold-tin (AuSn) eutectic mixture. This innovative design enhances the durability and performance of microelectronics packages.
Career Highlights
Kenneth Frazee has had a notable career at Qorvo US, Inc., where he has been instrumental in advancing microelectronics technology. His expertise in solder joint reliability has positioned him as a key figure in the development of innovative solutions for the industry. His work has not only contributed to the success of his company but has also had a lasting impact on the field of microelectronics.
Collaborations
Kenneth has collaborated with talented individuals such as Yinbao Yang and Xiaokang Huang. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas, leading to advancements in microelectronics technology.
Conclusion
Kenneth Frazee's contributions to microelectronics through his patented innovations demonstrate his commitment to enhancing the reliability of electronic packages. His work continues to influence the industry and pave the way for future advancements.