This inventor holds 2 USPTO granted patents. Top assignee: Motorola Corporation. Active years: 1996.
Company Filing History:
Years Active: 1996
Title: Innovations by Kenneth C. Ramsey
Introduction
Kenneth C. Ramsey is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative methods for interconnecting electrical system components, which are crucial in modern electronics.
Latest Patents
Kenneth's latest patents include a "Process for manufacturing a package for mating with a bare semiconductor" and a "Package for mating with a semiconductor die." The first patent describes a method where a leadframe is encapsulated within a molding compound to form an interconnect package. This package includes channels and is coupled together with adhesive material, allowing for the integration of a bare semiconductor chip. The second patent outlines a similar interconnect package design, emphasizing the encapsulation of leadframes and the coupling of semiconductor chips to the package edge.
Career Highlights
Kenneth C. Ramsey has had a distinguished career at Motorola Corporation, where he has applied his expertise in semiconductor technology. His innovative approaches have contributed to advancements in the efficiency and reliability of electronic components.
Collaborations
Throughout his career, Kenneth has collaborated with notable colleagues, including William J. Miller and William M. Strom. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Kenneth C. Ramsey's contributions to semiconductor packaging through his patents and work at Motorola Corporation highlight his role as a significant inventor in the field. His innovative methods continue to influence the development of electronic systems.