The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 1996
Filed:
Jun. 07, 1995
Kenneth C Ramsey, Gilbert, AZ (US);
William J Miller, Mesa, AZ (US);
William M Strom, Chandler, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An interconnect package (35) for interconnecting electrical system components. A first leadframe (10) having leads (11) is encapsulated within a molding compound forming a first section (36) of the interconnect package (35). The first section (36) optionally includes channels (54). A second leadframe (20) having leads (22, 23) is encapsulated within a molding compound forming a second section (37) of the interconnect package (35). The first and second sections (36 and 37, respectively) are coupled together with an adhesive material (43). An end (44) is removed from the interconnect package (35) forming an edge (50). A semiconductor chip (51) is coupled to the edge (50).