Kenji Sasaki

Title: Kenji Sasaki and Semiconductor Device Innovation.

Introduction

Kenji Sasaki is an inventor associated with Murata Manufacturing Co., Ltd. and based in Nagaokakyo, Japan. His listed patent focuses on semiconductor devices, modules, and systems, with particular attention to radio-frequency amplification and thermal management.

Latest Patents

Sasaki is credited with 1 patent: “Semiconductor device, semiconductor module, and system.” The invention describes a composite board made from two members, each incorporating a semiconductor board. The second semiconductor board has lower thermal conductivity than the first and contains a radio-frequency amplifier circuit with first transistors.

A conductor protrusion from the second member is electrically connected to the transistors and overlaps them at least partially when viewed from above. Another conductor protrusion extends from the composite board, with a connection part reaching one of the semiconductor boards. The design brings together electrical connections and semiconductor materials with different thermal properties.

Career Highlights

The available information identifies Sasaki’s work through this patent and his association with Murata Manufacturing Co., Ltd. The invention addresses structural and electrical features relevant to semiconductor modules and radio-frequency amplifier systems.

Collaborations

The patent connects Sasaki’s inventive work with Murata Manufacturing Co., Ltd. The provided information does not specify additional inventors, research partners, or collaborators.

Conclusion

Kenji Sasaki’s listed patent presents a semiconductor-board design that combines radio-frequency circuitry, conductor connections, and materials with differing thermal conductivity.