The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Mar. 26, 2024
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Kenji Sasaki, Nagaokakyo, JP;

Satoshi Goto, Nagaokakyo, JP;

Masayuki Aoike, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H03F 3/24 (2006.01); H10W 44/20 (2026.01);
U.S. Cl.
CPC ...
H10W 40/22 (2026.01); H03F 3/245 (2013.01); H10W 44/20 (2026.01); H03F 2200/451 (2013.01); H10W 44/231 (2026.01);
Abstract

A composite board includes a first member and a second member on a first surface that is one surface of the first member. A first conductor protrusion protrudes from the second member in a direction in which the first surface faces. A second conductor protrusion protrudes from the composite board in the direction in which the first surface faces. The first member includes a first semiconductor board, and the second member includes a second semiconductor board having lower thermal conductivity than the first semiconductor board. A radio frequency amplifier circuit including first transistors is in the second member. The first conductor protrusion is electrically connected to the first transistors and at least partially overlaps with the first transistors in a plan view of the first surface. The composite board includes a connection part that reaches the first semiconductor board or the second semiconductor board from the second conductor protrusion.


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