Company Filing History:
Years Active: 2018-2019
Title: Kenji Otsuka: Innovator in Thermal Expansion Resin Composition
Introduction
Kenji Otsuka is a notable inventor based in Hasuda, Japan. He has made significant contributions to the field of thermal expansion resin compositions. With a total of 2 patents, Otsuka's work showcases his expertise and innovative spirit.
Latest Patents
Otsuka's latest patents include a thermally expandable resin composition that contains an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin is formulated with a bisphenol-type epoxy compound and an aliphatic epoxy compound, with a weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound ranging from 95:5 to 60:40. Another patent focuses on a similar thermally expandable resin composition, which includes a brominated epoxy compound along with a bisphenol-type epoxy compound and/or an aliphatic epoxy compound. The weight ratio of the brominated epoxy compound to the other epoxy compounds is specified to be between 99:1 and 1:99.
Career Highlights
Throughout his career, Kenji Otsuka has worked with prominent companies such as Sekisui Chemical Co., Ltd. and Tokuyama Sekisui Co., Ltd. His experience in these organizations has contributed to his development as an inventor and innovator in the field of materials science.
Collaborations
Otsuka has collaborated with notable colleagues, including Toshitaka Yoshitake and Masaki Tono. These partnerships have likely enriched his work and expanded the impact of his inventions.
Conclusion
Kenji Otsuka's contributions to thermal expansion resin compositions highlight his innovative capabilities and dedication to advancing material technology. His patents reflect a deep understanding of epoxy resin formulations and their applications.