The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Oct. 10, 2013
Applicant:
Sekisui Chemical Co., Ltd., Osaka-shi, Osaka, JP;
Inventors:
Toshitaka Yoshitake, Hasuda, JP;
Masaki Tono, Tokyo, JP;
Kenji Otsuka, Hasuda, JP;
Hideaki Yano, Hasuda, JP;
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/20 (2006.01); C08G 59/50 (2006.01); C08K 3/04 (2006.01); C08K 3/00 (2018.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 3/32 (2006.01); C08K 5/3492 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); C08G 59/30 (2006.01); C08G 59/22 (2006.01); C08J 9/00 (2006.01);
U.S. Cl.
CPC ...
C08K 5/34928 (2013.01); C08G 59/226 (2013.01); C08G 59/308 (2013.01); C08G 59/504 (2013.01); C08J 9/0066 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/26 (2013.01); C08K 3/32 (2013.01); C08J 2363/02 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/265 (2013.01); C08K 2003/323 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01);
Abstract
A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.