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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9994693 B1

PDFFull Text
Date of Patent:
Jun. 12, 2018

Filed:

Oct. 10, 2013

Thermally expandable resin composition

Applicant:

Sekisui Chemical Co., Ltd., Osaka-shi, Osaka, JP;

Inventors:

Toshitaka Yoshitake, Hasuda, JP;

Masaki Tono, Tokyo, JP;

Kenji Otsuka, Hasuda, JP;

Hideaki Yano, Hasuda, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Irina S Zemel

Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08G 59/22 (2006.01); C08K 5/3492 (2006.01); C08K 3/04 (2006.01); C08K 3/26 (2006.01); C08K 3/32 (2006.01); C08G 59/30 (2006.01); C08G 59/50 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C08K 5/34928 (2013.01); C08G 59/226 (2013.01); C08G 59/308 (2013.01); C08G 59/504 (2013.01); C08J 9/0066 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/26 (2013.01); C08K 3/32 (2013.01); C08J 2363/02 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/265 (2013.01); C08K 2003/323 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01);
Abstract

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.

Find Patent Forward Citations

Yoshitake, Toshitaka. (2018). Thermally expandable resin composition (U.S. Patent No. 9994693). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9994693

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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