Kenji Otobe is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of electronic components, holding a total of six patents. His innovative designs focus on improving the performance and efficiency of electronic devices.

Latest Patents

One of Kenji Otobe's latest patents is a power amplifying module. This module features a package formed by welding a package bottom plate, which serves as a substrate, with a metal package cap. The design includes a wiring substrate placed on the package bottom plate, covered by the cap. Additionally, two through holes are formed in the wiring substrate, allowing for the positioning of heat spreaders that enhance thermal management. Another notable patent involves an electronic component contained in a metal package. This design includes an electronic circuit board mounted on a metal frame, covered by a metal lid. The innovative structure improves mechanical precision and electrical characteristics, particularly in high-frequency applications.

Career Highlights

Kenji Otobe works at Sumitomo Electric Industries, Limited, where he has been instrumental in developing advanced electronic components. His work has significantly impacted the industry, leading to more efficient and reliable electronic devices.

Collaborations

Kenji collaborates with notable coworkers, including Ken-ichiro Matsuzaki and Nobuo Shiga. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Kenji Otobe's contributions to electronic components through his patents and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence the development of advanced technologies in the electronics industry.

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