Company Filing History:
1 out of 59 
1 out of 832,880 Years Active: 2001
Title: Kenji Ohashi: Innovator in Semiconductor Technology
Introduction
Kenji Ohashi is a notable inventor based in Atsugi, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to epoxy resin compositions.
Latest Patents
Ohashi's latest patents include a semiconductor encapsulating epoxy resin composition and a semiconductor device. The first patent describes an epoxy resin composition that contains an epoxy resin, a phenolic resin curing agent, a curing catalyst, and an inorganic filler. The catalyst used is a quaternary phosphorus compound or a quaternary phosphorus compound that has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. This composition is effectively flowable, moldable, and curable, making it suitable for semiconductor encapsulation. The second patent also focuses on an epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator. A specific organic phosphorus compound is utilized as the curing accelerator, resulting in a composition that is smoothly flowing, stable during storage, effectively curable, and mold releasable.
Career Highlights
Throughout his career, Kenji Ohashi has worked with various companies, including Hokko Chemical Industry Co., Ltd. His work has significantly impacted the development of materials used in semiconductor applications.
Collaborations
Ohashi has collaborated with notable coworkers such as Tatsuya Ishizaki and Masayuki Umeno, contributing to advancements in their respective fields.
Conclusion
Kenji Ohashi's innovative work in semiconductor technology and his contributions to epoxy resin compositions highlight his importance as an inventor. His patents reflect a commitment to improving the efficiency and effectiveness of semiconductor encapsulation processes.