The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Jun. 22, 1999
Applicant:
Inventors:
Kenji Ohashi, Atsugi, JP;
Tatsuya Ishizaki, Atsugi, JP;
Masayuki Umeno, Chigasaki, JP;
Eiichi Asano, Usui-gun, JP;
Kazutoshi Tomiyoshi, Usui-gun, JP;
Shoichi Osada, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
C09D / ; C08L 6/300 ;
U.S. Cl.
CPC ...
C09D / ; C08L 6/300 ;
Abstract
An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.