The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2001
Filed:
Dec. 24, 1998
Kenji Ohashi, Atsugi, JP;
Tatsuya Ishizaki, Atsugi, JP;
Masayuki Umeno, Chigasaki, JP;
Eiichi Asano, Usui-gun, JP;
Shoichi Osada, Usui-gun, JP;
Kazutoshi Tomiyoshi, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Hokko Chemical Industry Co., Ltd., Tokyo, JP;
Abstract
An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is suited for semiconductor encapsulation. A specific organic phosphorus compound is used as the curing accelerator. The composition is smoothly flowing, stable during storage, effectively curable and mold releasable and can be molded and cured into products free from wire flow and voids.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile