Tokyo, Japan

Kenji Matsuhisa

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Toppan Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Matsuhisa. Retrieved from https://idiyas.com/inventor/kenji-matsuhisa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kenji Matsuhisa: Innovator in Laminate and Packaging Technologies

Introduction

Kenji Matsuhisa is an inventor based in Tokyo, Japan. He has made significant contributions to the field of laminate and packaging technologies. His innovative approaches focus on enhancing the recyclability and performance of packaging materials.

Latest Patent Applications

Kenji Matsuhisa has filed several notable patent applications. One of his latest applications is for a laminate, package, and packaged article. This laminate contains polyethylene and boasts excellent heat resistance and strength. It includes a substrate layer, an adhesive agent layer, and a sealant layer, with specific crystallinity measurements to ensure optimal performance. Another application focuses on a gas barrier film, which features a base material containing polyethylene and an inorganic oxide layer. This film is designed to maintain a low birefringence and a high proportion of polyethylene, enhancing its effectiveness as a packaging material.

Conclusion

Kenji Matsuhisa is an innovative inventor whose work in laminate and packaging technologies is paving the way for more sustainable and efficient materials. His latest patent applications reflect his commitment to advancing the field and addressing modern packaging challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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