This inventor holds 2 USPTO granted patents. Top assignee: Kyocera Corporation. Active years: 2003-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Kokubu, JP (2003)
- Yasu, JP (2012)
Company Filing History:
Years Active: 2003-2012
Title: Kenji Kume: Innovator in Resin Film and Multi-layer Wiring Substrate Technologies
Introduction
Kenji Kume is a notable inventor based in Yasu, Japan. He has made significant contributions to the fields of resin films and multi-layer wiring substrates. With a total of 2 patents to his name, Kume's work has advanced the technology used in electronic apparatuses and circuit boards.
Latest Patents
Kume's latest patents include innovations in resin film, adhesive sheets, circuit boards, and electronic apparatuses. One of his inventions relates to a resin film that exhibits high adhesiveness to other materials. This resin film features a plurality of projected portions, each containing a filler in the apex portion and a resin material. The projected portions are strategically formed on at least one surface of a sheet portion. Another significant invention is a multi-layer wiring substrate designed to meet the demands of high-density wiring packages, soldering thermal resistance, insulating properties, and high-frequency transmission characteristics. This substrate consists of multiple dielectric layers, each equipped with wiring conductors made of metallic foil, ensuring electrical connectivity through conductors formed within the dielectric layers.
Career Highlights
Kenji Kume is currently associated with Kyocera Corporation, a leading company in the technology sector. His work at Kyocera has allowed him to focus on developing innovative solutions that enhance electronic device performance and reliability.
Collaborations
Kume has collaborated with notable colleagues such as Tadashi Nagasawa and Takuji Seri. Their combined expertise has contributed to the successful development of advanced technologies in their respective fields.
Conclusion
Kenji Kume's contributions to resin film and multi-layer wiring substrate technologies highlight his innovative spirit and dedication to advancing electronic materials. His patents reflect a commitment to improving the functionality and efficiency of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile