The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Jan. 29, 2007
Applicants:
Tadashi Nagasawa, Yasu, JP;
Masaharu Shirai, Yasu, JP;
Kenji Kume, Yasu, JP;
Yutaka Tsukada, Yasu, JP;
Inventors:
Tadashi Nagasawa, Yasu, JP;
Masaharu Shirai, Yasu, JP;
Kenji Kume, Yasu, JP;
Yutaka Tsukada, Yasu, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 1/11 (2006.01); B32B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film () includes a plurality of projected portions () each having a filler () in an apex portion () and a resin material. The projected portions () are formed on at least one surface of a sheet portion ().