The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8129623 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 06, 2012

Filed:

Jan. 29, 2007
Applicants:

Tadashi Nagasawa, Yasu, JP;

Masaharu Shirai, Yasu, JP;

Kenji Kume, Yasu, JP;

Yutaka Tsukada, Yasu, JP;

Inventors:

Tadashi Nagasawa, Yasu, JP;

Masaharu Shirai, Yasu, JP;

Kenji Kume, Yasu, JP;

Yutaka Tsukada, Yasu, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 1/11 (2006.01); B32B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film () includes a plurality of projected portions () each having a filler () in an apex portion () and a resin material. The projected portions () are formed on at least one surface of a sheet portion ().


Find Patent Forward Citations

Nagasawa, Tadashi. (2012). Resin film, adhesive sheet, circuit board, and electronic apparatus (U.S. Patent No. 8129623). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8129623

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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