This inventor holds 1 USPTO granted patent. Top assignee: Renesas Electronics Corporation. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Kenji Kohzu: Innovator in Semiconductor Technology
Introduction
Kenji Kohzu is a notable inventor based in Hitachinaka, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Kenji Kohzu holds a patent for a semiconductor device, semiconductor wafer, and the manufacturing method of the same. This invention involves a process where an adhesive tape is attached to the main surface of a semiconductor wafer. A trench is then formed in the rear surface of the semiconductor wafer using photolithography technology. The resist film is patterned to ensure that no film remains in the trench formation area. The trench is subsequently created in a predetermined region of the semiconductor wafer through dry etching technology, specifically near the dicing line.
Career Highlights
Kenji Kohzu is currently employed at Renesas Electronics Corporation, where he continues to advance semiconductor technology. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
Kenji has collaborated with notable coworkers, including Yasuhiro Naka and Naotaka Tanaka, contributing to various projects within the semiconductor field.
Conclusion
Kenji Kohzu's innovative work in semiconductor technology exemplifies the importance of advancements in this critical industry. His patent reflects a commitment to improving manufacturing methods and enhancing product quality.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile