Kenji Kishibe

Title: Kenji Kishibe: Semiconductor Interconnection Innovations

Introduction

Kenji Kishibe is an inventor associated with Itami, Japan, and Mitsubishi Denki Kabushiki Kaisha. His work includes semiconductor integrated circuit interconnection structures designed to manage electrical connections between circuit layers. Kishibe is credited with 3 patents.

Latest Patents

Kishibe’s listed patents focus on semiconductor interconnection structures and methods for making them. The designs use insulating and conducting layers, with a through-hole connecting conducting layers across an insulating layer.

A key feature is a current barrier formed by an opening in the first conducting layer near the through-hole. The opening is filled with insulating material, directing current to flow around the barrier as it passes between the conducting layers. The related manufacturing method describes forming the layers and opening, filling the opening with insulating material, creating the through-hole, and depositing the second conducting layer to establish electrical contact.

Career Highlights

Kishibe’s patent work addresses the structure and fabrication of semiconductor integrated circuit interconnections. The described approach combines layered materials and a current-constraining feature near an electrical connection.

Collaborations

Kishibe is associated with Mitsubishi Denki Kabushiki Kaisha. His listed coworkers include Eisuke Tanaka and Shigeru Harada.

Conclusion

Kenji Kishibe’s listed inventions focus on semiconductor interconnection structures that shape current flow between circuit layers, reflecting his contributions to integrated circuit design and fabrication.