Kenji Iha

Title: Kenji Iha: Innovator in Double-Side Polishing Technology

Introduction

Kenji Iha is a notable inventor based in Uruma, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of double-side polishing technology. His innovative methods have enhanced the efficiency and effectiveness of wafer processing.

Latest Patents

Kenji Iha holds a patent for a method of producing a carrier for use in a double-side polishing apparatus. This patent, titled "Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers," outlines a process that includes engaging an insert with a holding hole formed in a carrier body. The method is designed to improve the way wafers are held and polished during the manufacturing process.

Career Highlights

Iha is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His work focuses on developing advanced techniques that streamline the polishing process, which is crucial for producing high-quality semiconductor wafers. With 1 patent to his name, Iha has established himself as a key player in his field.

Collaborations

Throughout his career, Kenji Iha has collaborated with talented professionals such as Kazuya Sato and Yuki Tanaka. These collaborations have fostered innovation and have contributed to the advancement of technologies in the semiconductor sector.

Conclusion

Kenji Iha's contributions to double-side polishing technology exemplify the importance of innovation in the semiconductor industry. His work continues to influence the efficiency of wafer processing, making him a significant figure in this field.