Tokyo, Japan

Kenji Furuyashiki

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: Aisin Seiki Kabushiki Kaisha, Komatsu Corporation, Nagoya University. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Furuyashiki. Retrieved from https://idiyas.com/inventor/kenji-furuyashiki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Kenji Furuyashiki: Innovator in Bonding Technology

Introduction

Kenji Furuyashiki is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative patent. His work has implications for various industries, including automotive manufacturing.

Latest Patents

Furuyashiki holds a patent for a bonding system and bonding method. This system includes a supporting jig with a mounting surface for bonding substrates, a bonding device that sandwiches and welds the substrates, an articulated robot to which the bonding device is attached, and a control unit that manages both the robot and the bonding device. This invention showcases his expertise in automation and precision engineering.

Career Highlights

Throughout his career, Kenji Furuyashiki has worked with prominent companies such as Toyota Customizing & Development Co., Ltd. and Aisin Seiki Kabushiki Kaisha. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.

Collaborations

Furuyashiki has collaborated with talented individuals in his field, including Hiroshi Yuchi and Satoshi Hirawaki. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Kenji Furuyashiki is a distinguished inventor whose work in bonding technology has made a significant impact. His patent and collaborations reflect his commitment to advancing engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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