The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Mar. 23, 2018
Toyota Customizing & Development Co., Ltd., Yokohama, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Aisin Seiki Kabushiki Kaisha, Kariya, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
National University Corporation Nagoya University, Nagoya, JP;
Toray Industries, Inc., Tokyo, JP;
Teijin Limited, Osaka, JP;
Komatsu Ltd., Tokyo, JP;
Subaru Corporation, Tokyo, JP;
Kenji Furuyashiki, Tokyo, JP;
Hiroshi Yuchi, Tokyo, JP;
Satoshi Hirawaki, Wako, JP;
Yoshinori Yamamori, Tokyo, JP;
Takayuki Mori, Kariya, JP;
Yoshihiro Iwano, Toyota, JP;
Kazuaki Amaoka, Nagoya, JP;
TOYOTA CUSTOMIZING & DEVELOPMENT CO., LTD., Yokohama, JP;
AISIN SEIKI KABUSHIKI KAISHA, Kariya, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY, Nagoya, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
TEIJIN LIMITED, Osaka, JP;
KOMATSU LTD., Tokyo, JP;
SUBARU CORPORATION, Tokyo, JP;
Abstract
A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.