Okazaki, Japan

Kenji Arai

This inventor holds 4 USPTO granted patents. Top assignee: Denso Corporation. Active years: 2001-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Arai. Retrieved from https://idiyas.com/inventor/kenji-arai-63cyjh7z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 75.0

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2001-2002

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4 patents (USPTO):Explore Patents

Title: Kenji Arai: Innovator in Soldering Technology

Introduction

Kenji Arai is a notable inventor based in Okazaki, Japan. He has made significant contributions to the field of soldering technology, holding a total of 4 patents. His innovative approaches have enhanced the quality and efficiency of soldering processes in various applications.

Latest Patents

One of Kenji Arai's latest patents is a wave soldering method and system used for the method. This method involves soldering a work-piece while controlling the immersion depth of the work-piece into the wave molten solder to maintain a constant level. The control is achieved by adjusting either the height position of the work-piece or the wave height of the molten solder based on the displacement of the work-piece. This innovation allows for high-quality soldering even when the work-piece is thermally warped.

Another significant patent is a flow soldering apparatus featuring a resilient substrate clamping mechanism and a solder oxide film removing mechanism. In this apparatus, a substrate is clamped by a pair of nails in a chuck mechanism and is transferred over a molten solder barrel while in contact with the solder. The resilient design of the nails allows for thermal expansion of the substrate without bowing. Additionally, the chuck mechanism includes a scraper nail that removes oxide film from the molten solder, ensuring a clean soldering process.

Career Highlights

Kenji Arai is currently employed at Denso Corporation, where he continues to develop innovative soldering technologies. His work has been instrumental in advancing the capabilities of soldering equipment and processes.

Collaborations

Kenji collaborates with talented coworkers, including Ataru Ichikawa and Misao Tanaka. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Kenji Arai's contributions to soldering technology through his patents and work at Denso Corporation highlight his role as a leading inventor in the field. His innovative methods and apparatuses continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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