The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Jun. 29, 1999
Atushi Furumoto, Kariya, JP;
Ataru Ichikawa, Kariya, JP;
Tatsuya Kubo, Ogaki, JP;
Misao Tanaka, Takahama, JP;
Mitsuhiro Sugiura, Okazaki, JP;
Kenji Arai, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.