Hachioji, Japan

Kenichi Tomihara

This inventor holds 1 USPTO granted patent. Top assignee: Threebond Co., Ltd.. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenichi Tomihara. Retrieved from https://idiyas.com/inventor/kenichi-tomihara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Kenichi Tomihara: Inventor of a Self-Locking Agent

Introduction

Kenichi Tomihara is an inventor associated with Hachioji, Japan, and Threebond Co., Ltd. His listed patent concerns a self-locking agent designed for fastening devices. The available information identifies 1 patent associated with him.

Latest Patents

Tomihara’s listed invention, “Self-locking agent,” is a microencapsulated adhesive composition intended for use in a fastening device. It combines an epoxy compound with at least two epoxy groups, a specified aromatic diamine, and at least one additional compound selected from thiosalicylic acid, salicylic acid, benzoic anhydride, boron trifluoride, or boron trifluoride complexes.

At least one of the epoxy compound and aromatic diamine is microencapsulated to keep the reactive constituents apart. The patent describes the agent as offering thermal resistance and storage stability.

Career Highlights

The available details connect Tomihara’s patent work with Threebond Co., Ltd. and identify Hachioji as his location. His listed invention addresses adhesive formulation and the performance of fastening devices.

Collaborations

Minami Hanada and Isao Noguchi are identified as Tomihara’s coworkers. The provided information does not specify their roles in the patent or any particular collaboration.

Conclusion

Kenichi Tomihara’s listed patent presents a microencapsulated adhesive approach for self-locking fastening devices, with an emphasis on thermal resistance and storage stability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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