IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Kenichi Tokuno

USPTO Granted Patents = 10

Average Co-Inventor Count = 1.7

ph-index = 9

Forward Citations = 499(Granted Patents)


Company Filing History:

goldMedal10 out of 35,658 
 
Nec Corporation
 patents

Years Active: 1996-2001

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10 patents (USPTO):Explore Patents
1. 6188127 - Semiconductor packing stack module and method of producing the same (2001-02-13),
2. 6094354 - Chip component mounting board, chip component mounting structure, and (2000-07-25),
3. 5892289 - Bare chip mounting structure and manufacturing method therefor (1999-04-06),
4. 5883426 - Stack module (1999-03-16),
5. 5869886 - Flip chip semiconductor mounting structure with electrically conductive (1999-02-09),
6. 5777847 - Multichip module having a cover wtih support pillar (1998-07-07),
7. 5767689 - Bare chip test carrier with an improved holding structure for a (1998-06-16),
8. 5763295 - Device module comprising a substrate having grooves fixed to circuit (1998-06-09),
9. 5686763 - Device module comprising a substrate having grooves fixed to circuit (1997-11-11),
10. 5565704 - Memory card having two types of memory integrated circuits connected to (1996-10-15),

Title: Kenichi Tokuno: Innovator in Semiconductor Technology

Introduction

Kenichi Tokuno is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative work has paved the way for advancements in semiconductor packaging and mounting techniques.

Latest Patents

One of his latest patents is for a semiconductor packing stack module and method of producing the same. This invention involves mounting a Large Scale Integrated (LSI) circuit on a ceramic carrier substrate or a flexible carrier film using fine bumps. After injecting seal resin, the chip is thinned through grinding. Multiple carrier substrates or films are interconnected by bumps via through holes, resulting in a tridimensional stack module. This design achieves a miniature, thin, dense, low-cost, and reliable structure without the need for wire bonding or a Tape Automated Bonding (TAB) system. Additionally, it minimizes wiring length and enhances electrical characteristics. Another notable patent is for a chip component mounting board, which includes a chip mounting portion and a first groove. This groove extends from the center of the mounting portion to one side, gradually increasing in width, allowing for efficient chip component mounting.

Career Highlights

Kenichi Tokuno is currently employed at NEC Corporation, where he continues to innovate in semiconductor technologies. His work has been instrumental in developing advanced solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Kenichi has collaborated with notable colleagues, including Manabu Bonkohara and Akihiro Dohya. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Kenichi Tokuno's contributions to semiconductor technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of the complexities involved in semiconductor packaging and mounting, making him a key figure in the industry.

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