Nec Corporation

Kenichi Tokuno

Manabu Bonkohara

Akihiro Dohya

Naoji Senba

Yuzo Shimada

Kazuaki Utsumi

Akihiro Doya

Ikushi Morisaki

Kazuaki Utumi

Ikushi Morizaki

Yuuzou Shimada

Toshiaki Nakajoh

In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A plurality of such carrier substrates or carrier films are connected to each other by bumps via through holes which are electrically connected to the wiring conductors, thereby completing a tridimensional stack module. The module achieves a miniature, thin, dense, low cost, and reliable structure without resorting to a wire bonding system or a TAB (Tape Automated Bonding) system. In addition, the module has a minimum of wiring length and a desirable electric characteristic.

Semiconductor packing stack module and method of producing the same

A chip component mounting board includes a chip mounting portion and a first groove. A chip component is mounted on the chip mounting portion. The chip mounting portion has a connection pad electrically connected to the chip component. The first groove is formed in the chip mounting portion to extend from a center of the chip mounting portion to one side of the chip mounting portion while gradually increasing its width. A method of manufacturing a chip component mounting board is also disclosed.

Chip component mounting board, chip component mounting structure, and

A mounting structure is provided which improves the reliability of the connection between the bumps at the four corners of a flip-chip mounted semiconductor chip which is subject to stress concentrations caused by board warping or a difference in thermal coefficient of expansion when subjecting the mounted chip to thermal cycling tests. In this structure, a sealing resin is caused to flow into a space between the semiconductor chip and the board at the four corners of the semiconductor chip, thereby forming large resin fillets at the four corners, these fillets relieving the above-noted stress at the bump connection parts of the four corners of the semiconductor chip, thereby causing an improvement in reliability of the connection. The flowing distance is shortened and simultaneous flowing resin is performed, thereby shortening the time required for sealing.

Bare chip mounting structure and manufacturing method therefor

A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.

Stack module

A semiconductor chip is flip chip bonded on a substrate wherein the semiconductor chip has a first surface on which bumps are provided. An insulating sealing resin is provided in a space defined between the semiconductor chip and the substrate and also around the semiconductor chip. An electrically conductive resin is provided which extends over a least a part of a second surface of the semiconductor chip, a part of the sealing resin and a ground pattern provided over the substrate.

Flip chip semiconductor mounting structure with electrically conductive

A multichip module comprises a substrate mounting a plurality of circuit chips, a cover plate positioned over the circuit chips, and at least one pillar member for fixing the cover plate to the substrate to support it. The substrate has a plurality of circuit chips fixed in a predetermined pattern of locations on a side thereof. At least one pillar member fixes the cover plate to the substrate such that the cover plate is positioned over the circuit chips. Since the pillar member is fixed to the substrate at a small area to support the cover plate, the substrate can be prevented from deforming due to a temperature change. In order to secure the covering member, the pillar member is preferably fixed by means of an adhesive, a fit, or screwing.

Multichip module having a cover wtih support pillar

A chip tester for holding a semiconductor chip bonded via convex electrodes to a flexible substrate. The tester has a carrier body with a flat surface in contact with the flexible board. The carrier body overlies the flexible substrate so as to press down the flexible substrate. The tester also has a chip plate that underlies and contacts the semiconductor chip so as to urge the semiconductor chip toward the flexible substrate. At least a flat contact surface of the chip plate is made of an elastic material with a high elastic coefficient to obtain an adhesion with the semiconductor chip to prevent lateral displacement of the semiconductor chip. The tester also has a chip plate holder that underlies the flexible substrate and is positioned around both the semiconductor chip and the chip plate. The chip plate holder is spaced apart from the semiconductor chip so that the chip plate holder sandwiches the flexible substrate in cooperation with the carrier body.

Bare chip test carrier with an improved holding structure for a

A device module with a circuit chip and a print-circuit substrate on which a pattern of grooves is formed by selective etching. A liquid sealing material is in the space between the circuit chip and the surface of the substrate, fixing the circuit chip on the surface of the substrate. The circuit chip has a plurality of electrodes arranged in a first pattern, and the substrate has a plurality of connection terminals arranged in the first pattern within a chip mounting area on a surface thereof. Each of the grooves passes between two adjacent connection terminals through the chip mounting area, and both ends of each groove protrudes from the periphery of the chip mounting area. After the circuit chip is placed on the chip mounting area with the respective electrodes corresponding to the connection terminals, a liquid sealing material may be spread more easily into the space between the circuit chip and the substrate by the use of capillary action to provide a more reliable and efficient seal.

Device module comprising a substrate having grooves fixed to circuit

A memory card includes two types of memory integrated circuits (ICs) and two connectors located on opposite sides of the card. One connector is electrically connected to one type of memory ICs, and the other connector is electrically connected to the other type of memory ICs. This allows two kinds of functions to coexist within a single memory card. The two types of memory ICs are a dynamic random access memory (DRAM) IC and a read-only memory (ROM) IC, respectively.

Growing community of inventors

Tokyo, Japan

Kenichi Tokuno