Heverlee, Belgium

Kenichi Miyaguchi

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Imec Vzw. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenichi Miyaguchi. Retrieved from https://idiyas.com/inventor/kenichi-miyaguchi-ycvsbmk5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kenichi Miyaguchi: Semiconductor Invention and Patent

Introduction

Kenichi Miyaguchi is an inventor associated with imec Vzw in Heverlee, Belgium. His recorded patent concerns semiconductor components and metal-insulator-metal (MIM) capacitor structures.

Latest Patents

Miyaguchi is credited with 1 patent: “Semiconductor Component with Metal-Insulator-Metal Capacitor Assembly.” The invention describes a multilayer semiconductor structure containing multiple MIM capacitors arranged as a stack of at least three conductive layers separated by dielectric layers. The stack is formed conformally over dielectric pillars distributed across a conductive bottom plate. Differences in pillar heights make intermediate layers accessible for electrical connections through vias.

Career Highlights

The patent reflects work on integrating capacitor assemblies into multilayer interconnect structures. Its design uses the underlying topography to support the capacitor stack and provide access to its conductive layers.

Collaborations

Miyaguchi’s listed coworker is Philip Nolmans. The patent information associates Miyaguchi with imec Vzw.

Conclusion

Kenichi Miyaguchi’s recorded invention addresses the structure and electrical accessibility of MIM capacitors in semiconductor components, highlighting his contribution to semiconductor interconnect technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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