Tokyo, Japan

Kengo Okamura

This inventor holds 5 USPTO granted patents and 2 EPO patents. Top assignee: Toppan Printing Co., Ltd.. Active years: 2020-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kengo Okamura. Retrieved from https://idiyas.com/inventor/kengo-okamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 80.0


Average Co-Inventor Count = 3.2

ph-index = 1


Company Filing History:


Years Active: 2020-2023

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5 patents (USPTO):Explore Patents

Title: Kengo Okamura: Innovator in Packaging Technology

Introduction

Kengo Okamura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging technology, holding a total of 5 patents. His innovative work focuses on developing advanced packaging materials that enhance product preservation and safety.

Latest Patents

Okamura's latest patents include a packaging body constituted by a sheet that features a gas barrier laminate and a sealant. This packaging body is designed to accommodate contents that contain a sulfur-containing amino acid. The gas barrier laminate comprises a resin substrate, a first layer containing an inorganic oxide, a second layer containing a carboxylic acid polymer, and a third layer containing a polyvalent metal compound and a resin. The layers are arranged in a specific order from the outside to the inside of the packaging body, with the thickness of the third layer being 0.1 μm or more and the sulfur content of the second layer being 1.0 atm % or less. Another notable patent involves a gas barrier laminate that includes a resin substrate, a first coating layer with a carboxylic acid polymer, and a second coating layer with a polyvalent metal compound and a resin. The thickness ratio of the second coating layer to the first is maintained between 1.0 and 4.0, ensuring optimal performance.

Career Highlights

Kengo Okamura is associated with Toppan Printing Co., Ltd., where he has been instrumental in advancing packaging technologies. His work has not only contributed to the company's reputation but has also set new standards in the industry.

Collaborations

Okamura has collaborated with notable coworkers such as Miki Fukugami and Kenji Matsumasa. Their combined expertise has fostered innovation and development in packaging solutions.

Conclusion

Kengo Okamura's contributions to packaging technology exemplify the importance of innovation in enhancing product safety and preservation. His patents reflect a commitment to advancing the field and improving consumer products.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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