Company Filing History:
Years Active: 2015-2020
Title: Kengo Iokibe: Innovator in Printed Wiring Board Technology
Introduction
Kengo Iokibe is a notable inventor based in Okayama, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of five patents. His innovative designs focus on enhancing the efficiency and functionality of electronic components.
Latest Patents
Iokibe's latest patents include advancements in printed wiring boards that feature a power supply layer and a ground layer. One of his designs incorporates a power supply layer pattern that includes a power supply layer electrode and a branch, which serves as a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. Additionally, he has developed a capacitive coupling element that is strategically positioned to oppose the power supply layer electrode, ensuring optimal performance. Another patent further refines this concept by detailing a power supply layer pattern that includes a branch and a power supply layer electrode, enhancing the connectivity of EBG unit cells through a via.
Career Highlights
Throughout his career, Kengo Iokibe has worked with esteemed organizations such as Okayama University and Kyocera Corporation. His experience in these institutions has allowed him to collaborate on various projects that push the boundaries of technology in printed wiring boards.
Collaborations
Iokibe has had the opportunity to work alongside talented individuals in his field, including Yoshitaka Toyota and Toshiyuki Kaneko. Their collaborative efforts have contributed to the advancement of innovative technologies in electronics.
Conclusion
Kengo Iokibe's work in printed wiring board technology exemplifies his commitment to innovation and excellence. His patents reflect a deep understanding of electronic design, making him a significant figure in the industry.