Kyocera Corporation

Okayama University

Nec Tokin Corporation

Kengo Iokibe

Yoshitaka Toyota

Masanori Naito

Toshihisa Uehara

Toshiyuki Kaneko

Koichi Kondo

Yuki Yamashita

Kiyohiko Kaiya

Xingxiaoyu Lin

Naoharu Yamamoto

Farhan Zaheed Mahmood

A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.

Printed wiring board

A printed wiring board of the present disclosure includes a power supply layer and a ground layer. A power supply layer pattern to be formed partially on the power supply layer includes a branch and a power supply layer electrode. The branch is a direct-current power feeding path for connecting adjacent electromagnetic band gap (EBG) unit cells, and the power supply layer electrode is connected through a slit provided along the branch. A capacitive coupling element disposed to oppose the power supply layer electrode with an interlayer being provided therebetween has a structure in which the EBG unit cells are disposed at regular intervals, the EBG unit cells being connected to the branch in the power supply layer pattern through a via.

A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.

Printed wiring board and method of producing the same

A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. EBG unit cells are disposed on a boundary between the digital circuit and the analog circuit one dimensionally or two dimensionally and periodically, and an interdigital electrode is formed. A magnetic body film is formed over the printed wiring board, partially formed on the EBG unit cells, or formed avoiding the EBG unit cells.

A resonator is connected to a first plane which is one of a power plane and a ground plane, wherein the power plane and the ground plane are apart from each other in an up-down direction. The resonator comprises a connecting portion and a body portion. The connecting portion is connected to the first plane. The connecting portion extends in the up-down direction beyond a second plane, which is a remaining one of the power plane and the ground plane, while not being in electrical contact with the second plane. The body portion is connected to the connecting portion while not being in contact with the second plane. The body portion is arranged so that the second plane is located between the body portion and the first plane in the up-down direction.

Growing community of inventors

Okayama, Japan

Kengo Iokibe