The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Jul. 20, 2017
Applicants:

National University Corporation Okayama University, Okayama-shi, Okayama, JP;

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Yoshitaka Toyota, Oakayama, JP;

Kengo Iokibe, Okayama, JP;

Xingxiaoyu Lin, Okayama, JP;

Toshiyuki Kaneko, Hachioji, JP;

Masanori Naito, Fuchu, JP;

Toshihisa Uehara, Sagamihara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 9/00 (2006.01); H01P 1/16 (2006.01); H01P 1/20 (2006.01); H01P 1/203 (2006.01); H01L 31/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); H05K 1/02 (2013.01); H05K 1/115 (2013.01); H05K 1/162 (2013.01); H05K 3/46 (2013.01); H05K 1/0231 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09254 (2013.01);
Abstract

A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.


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