Company Filing History:
Years Active: 2014
Title: Keng Yuen Au: Innovator in Semiconductor Packaging
Introduction
Keng Yuen Au is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a focus on innovative methods for device stacking, he has made significant strides in enhancing the efficiency and effectiveness of semiconductor devices.
Latest Patents
Keng Yuen Au holds a patent for a "Semiconductor package and method of packaging semiconductor devices." This patent presents a method of forming a device stack that includes providing a temporary substrate with a mounting surface. The process involves temporarily mounting a first chip to the substrate, bonding it with a second chip, and ultimately separating the chip stack from the substrate. This innovative approach aims to improve the integration and performance of semiconductor devices.
Career Highlights
Keng Yuen Au is currently employed at United Test and Assembly Center Limited, a company known for its expertise in semiconductor testing and assembly. His work at this organization has allowed him to apply his inventive skills in a practical setting, contributing to advancements in the semiconductor industry.
Collaborations
Keng Yuen Au has collaborated with several talented individuals in his field, including Chin Hock Toh and Reynaldo Vincent Hernandez Sta Agueda. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Keng Yuen Au's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent and work at United Test and Assembly Center Limited highlight his role as a key player in advancing semiconductor technology.