This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Broadcom Corporation. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Ken Zhonghua Wu: Innovator in Flip Chip Packaging Technology
Introduction
Ken Zhonghua Wu is a prominent inventor based in Fremont, CA (US). He is known for his significant contributions to the field of semiconductor packaging. With a focus on developing innovative solutions, Wu has made strides in enhancing the performance and cost-effectiveness of flip chip packages.
Latest Patents
Wu holds a patent for a "Low cost and high performance flip chip package." This invention discloses a method of assembling the package using a substrate panel level process. By avoiding the separate fabrication of a substrate, the use of a coreless substrate is enabled. The coreless substrate consists of multiple stacked layers of laminate dielectric films that contain conductive traces and vias. This design allows for direct electrical connection routes from die contact pads to package contact pads without conventional solder bumps. Consequently, this innovation accommodates very high-density semiconductor dies with small feature sizes. The disclosed flip chip package offers lower costs, higher electrical performance, and improved thermal dissipation compared to traditional fabricated substrates with solder bumped semiconductor dies.
Career Highlights
Ken Zhonghua Wu is currently employed at Broadcom Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of flip chip packaging, making it more accessible and efficient for various applications.
Collaborations
Wu has collaborated with notable colleagues, including Mengzhi Pang and Matthew Vernon Kaufmann. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Ken Zhonghua Wu's contributions to the field of semiconductor packaging, particularly through his patented flip chip package, highlight his role as a key innovator. His work not only enhances performance but also reduces costs, making significant impacts in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile