Sunnyvale, CA, United States of America

Ken Hua

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Instrumental, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ken Hua. Retrieved from https://idiyas.com/inventor/ken-hua

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ken Hua: Inventor in Automated Measurement

Introduction

Ken Hua is an inventor based in Sunnyvale, California, and is associated with Instrumental, Inc. His patent work addresses automated inspection and measurement across multiple assembly units.

Latest Patents

Hua is credited with 1 patent: “Methods for Automatically Generating a Common Measurement Across Multiple Assembly Units.” The method identifies key features in inspection images, extracts their real-world dimensions, and displays those dimensions near the corresponding features. It also uses user confirmation of selected features in one image to help identify relevant features in a second image, supporting consistent measurements across assembly units.

Career Highlights

Hua’s listed patent reflects work at the intersection of image-based inspection, geometric analysis, and automated measurement. His association with Instrumental, Inc. connects this invention to the company’s work in manufacturing inspection technology.

Collaborations

The patent’s described process combines automated image analysis with user confirmation, illustrating how human input can guide feature identification across inspection images. Instrumental, Inc. is the company associated with Hua in the provided information.

Conclusion

Ken Hua’s patent focuses on generating consistent measurements from inspection images, with the goal of supporting reliable comparison across multiple assembly units.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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