Austin, TX, United States of America

Kelvin D Goveas

This inventor holds 1 USPTO granted patent. Top assignee: Ventana Micro Systems Inc.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kelvin D Goveas. Retrieved from https://idiyas.com/inventor/kelvin-d-goveas

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Kelvin D Goveas

Introduction

Kelvin D Goveas is an accomplished inventor based in Austin, TX. He has made significant contributions to the field of system on chip (SoC) technology. His innovative work focuses on improving communication between chiplets, which is crucial for enhancing the performance of integrated circuits.

Latest Patents

Kelvin D Goveas holds a patent for a "Method and apparatus for deskewing die to die communication between system on chip devices." This patent describes a die-to-die (D2D) interface that connects chiplets within a SoC. The interface is designed to manage communication between different slices of chiplets, ensuring efficient data transfer despite varying delays in transmission paths.

Career Highlights

Kelvin is currently employed at Ventana Micro Systems Inc., where he continues to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of SoC designs, making them more efficient and reliable.

Collaborations

Kelvin has collaborated with notable colleagues, including David A Kruckemyer and John G Favor. These partnerships have fostered a creative environment that encourages innovation and the development of new ideas.

Conclusion

Kelvin D Goveas is a prominent figure in the field of semiconductor technology, with a focus on enhancing communication between chiplets in SoC devices. His contributions are paving the way for future advancements in this critical area of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…