Hillsboro, OR, United States of America

Kelly Eakins

This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2012-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kelly Eakins. Retrieved from https://idiyas.com/inventor/kelly-eakins

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2012-2014

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2 patents (USPTO):Explore Patents

Title: Kelly Eakins: Inventor of LGA Socket Retention Innovations.

Introduction

Kelly Eakins is an inventor based in Hillsboro, Oregon, whose patent work concerns land grid array (LGA) socket designs. She is associated with Intel Corporation and has 2 patents listed in the information provided.

Latest Patents

Eakins’s listed patents include “Method of Placing a Chip Assembly in a Socket Housing” and “Sliding Package Retention Device for LGA Sockets.” Both describe LGA socket designs that use inclined engagement features to convert lateral force into normal force, helping retain a package in its socket. The described arrangement positions engagement features along the socket’s side to distribute force more uniformly across the solder ball array than existing mechanisms.

Career Highlights

The patent information connects Eakins’s work with Intel Corporation and highlights her contributions to chip assembly placement and package retention in LGA sockets. These inventions address mechanical retention and load distribution in electronic packaging.

Collaborations

The provided information lists Tozer J. Bandorawalla and Alan C. McAllister as Eakins’s coworkers. Their names are associated with her professional context, though specific roles in the listed patents are not provided.

Conclusion

Kelly Eakins’s listed patents focus on improving how LGA sockets retain chip packages and distribute mechanical loads, reflecting her work in electronic packaging innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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