This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2012-2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012-2014
Title: Kelly Eakins: Inventor of LGA Socket Retention Innovations.
Introduction
Kelly Eakins is an inventor based in Hillsboro, Oregon, whose patent work concerns land grid array (LGA) socket designs. She is associated with Intel Corporation and has 2 patents listed in the information provided.
Latest Patents
Eakins’s listed patents include “Method of Placing a Chip Assembly in a Socket Housing” and “Sliding Package Retention Device for LGA Sockets.” Both describe LGA socket designs that use inclined engagement features to convert lateral force into normal force, helping retain a package in its socket. The described arrangement positions engagement features along the socket’s side to distribute force more uniformly across the solder ball array than existing mechanisms.
Career Highlights
The patent information connects Eakins’s work with Intel Corporation and highlights her contributions to chip assembly placement and package retention in LGA sockets. These inventions address mechanical retention and load distribution in electronic packaging.
Collaborations
The provided information lists Tozer J. Bandorawalla and Alan C. McAllister as Eakins’s coworkers. Their names are associated with her professional context, though specific roles in the listed patents are not provided.
Conclusion
Kelly Eakins’s listed patents focus on improving how LGA sockets retain chip packages and distribute mechanical loads, reflecting her work in electronic packaging innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
