Kejian Wu

Title: Kejian Wu: Innovator in Welding Technology

Introduction

Kejian Wu is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of welding technology, particularly through his innovative methods involving ceramic substrates. His work has implications for various electronic applications, showcasing the intersection of materials science and engineering.

Latest Patents

Kejian Wu holds a patent for a "Welding method of demetallized ceramic substrate having surface capillary microgroove structure." This invention discloses a unique welding method that utilizes a demetallized ceramic substrate featuring surface capillary microstructures. The method involves fixing a chip to the substrate, securing it to a printed circuit board, and using capillary force to drive melted solder to create an electrical connection. This innovative approach enhances the reliability and efficiency of electronic component assembly.

Career Highlights

Throughout his career, Kejian Wu has been associated with prominent institutions and companies. He has worked at the South China University of Technology, where he contributed to research and development in engineering. Additionally, he has been involved with Guangdong Luckystar Electronic Technology Co., Ltd., furthering his expertise in electronic technologies.

Collaborations

Kejian Wu has collaborated with notable colleagues, including Zongtao Li and Yong Zhao Tang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in the field of welding technology.

Conclusion

Kejian Wu's contributions to welding technology, particularly through his patented methods, highlight his role as an innovator in the field. His work not only advances the technology but also sets a foundation for future developments in electronic assembly techniques.