Kokubunji, Japan

Keizo Matsukawa


Average Co-Inventor Count = 12.0

ph-index = 1

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 1991

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1 patent (USPTO):Explore Patents

Title: Keizo Matsukawa: Innovator in TAB Technology

Introduction

Keizo Matsukawa is a notable inventor based in Kokubunji, Japan. He has made significant contributions to the field of multi-pin chip mounting technology, particularly through his innovative work with the Tape Automated Bonding (TAB) system. His expertise has led to advancements that enhance the efficiency and accuracy of chip bonding processes.

Latest Patents

Matsukawa holds a patent for a method of aligning and bonding tab inner leads. This invention relates to a multi-pin chip mounting method and apparatus that utilizes a TAB system. The process involves aligning leads formed on a tape with bumps on an integrated circuit (IC) chip, followed by a compress-bonding procedure. The method ensures precise alignment and bonding, which is crucial for the performance of electronic devices.

Career Highlights

Keizo Matsukawa has had a distinguished career at Hitachi, Ltd., where he has been instrumental in developing advanced technologies in the semiconductor industry. His work has not only contributed to the company's success but has also influenced the broader field of electronics manufacturing.

Collaborations

Matsukawa has collaborated with esteemed colleagues such as Michio Takahashi and Tooru Mita. These partnerships have fostered innovation and have been pivotal in advancing the technologies they work on.

Conclusion

Keizo Matsukawa's contributions to the field of TAB technology exemplify his commitment to innovation in electronics. His patent and collaborative efforts continue to impact the industry positively.

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