Enter inventor name

Keith William Gaff

This inventor holds 50 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Electrostatic Chucks. Top assignee: Lam Research Corporation. Active years: 2009-2025.

USPTO Granted Patents = 50 (Patent Applications = 2)

% Patents Active = 90.0

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 3.4

ph-index = 12

Forward Citations = 987(Granted Patents)

Forward Citations (Not Self Cited) = 902(Dec 10, 2025)

Location History:

Alameda, CA (US) (2015 - 2020)
Fremont, CA (US) (2009 - 2024)

Company Filing History:

50 out of 3,928

Lam Research Corporation

patents

Years Active: 2009-2025

Loading Chart...

Areas of Expertise:

Electrostatic Chuck

Ceramic Baseplate

Plasma Processing

Temperature Control

Substrate Support

Edge Seal

Thermal Zones

RF Power Delivery

Cooling-Gas Prevention

CD Uniformity

Magnetic Fields

Elastomer Seal

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12451335 - Multi-plate electrostatic chucks with ceramic baseplates (2025-10-21),

2. 12368025 - Edge seal for lower electrode assembly (2025-07-22),

3. 12227840 - Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating (2025-02-18),

4. 11967517 - Electrostatic chuck with ceramic monolithic body (2024-04-23),

5. 11935776 - Electrostatically clamped edge ring (2024-03-19),

6. 11848177 - Multi-plate electrostatic chucks with ceramic baseplates (2023-12-19),

7. 11781650 - Edge seal for lower electrode assembly (2023-10-10),

8. 11651991 - Electrostatic Chuck design for cooling-gas light-up prevention (2023-05-16),

9. 11069553 - Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity (2021-07-20),

10. 11024532 - Electrostatic chuck design for cooling-gas light-up prevention (2021-06-01),

11. 10923380 - Electrostatically clamped edge ring (2021-02-16),

12. 10892197 - Edge seal configurations for a lower electrode assembly (2021-01-12),

13. 10872748 - Systems and methods for correcting non-uniformities in plasma processing of substrates (2020-12-22),

14. 10804129 - Electrostatic chuck assembly incorporation a gasket for distributing RF power to a ceramic embedded electrode (2020-10-13),

15. 10804081 - Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamber (2020-10-13),

Sure, I can help you with that! Here is an article about inventor Keith William Gaff:

Title: Keith William Gaff: Pioneering Innovations in Semiconductor Substrate Processing

Introduction:

Keith William Gaff is a highly accomplished inventor based in Fremont, CA (US) known for his significant contributions to the field of semiconductor substrate processing. With an impressive portfolio of 45 patents, Gaff has been a driving force behind cutting-edge technological advancements in the industry.

Latest Patents:

Gaff's latest patents include groundbreaking inventions such as "Multi-plate electrostatic chucks with ceramic baseplates" and "Edge seal for lower electrode assembly." These innovations showcase his expertise in developing sophisticated systems to enhance substrate processing efficiency and precision.

Career Highlights:

Currently employed at Lam Research Corporation, Gaff has played a pivotal role in the company's research and development efforts. His innovative solutions have helped position Lam Research Corporation as a leader in the semiconductor equipment industry, driving technological progress and setting new standards for excellence.

Collaborations:

Throughout his career, Gaff has collaborated with esteemed professionals in the field, including Keith Laurence Comendant and Harmeet Singh. These partnerships have resulted in the successful execution of complex projects and the development of cutting-edge technologies that have revolutionized the semiconductor industry.

Conclusion:

In conclusion, Keith William Gaff's inventive spirit and dedication to excellence have solidified his reputation as a pioneer in semiconductor substrate processing. His passion for innovation and commitment to pushing the boundaries of technological possibilities continue to inspire advancements that shape the future of the industry.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to [email protected]