Keith E Nelson

Title: Innovations of Keith E Nelson

Introduction

Keith E Nelson is a prominent inventor based in Tempe, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work has been instrumental in advancing microelectronic packaging solutions.

Latest Patents

Among his latest patents, one notable invention is the "Semiconductor package and method therefor." This patent describes a semiconductor package substrate that features an array of package sites that are substantially identical. The entire array is covered by an encapsulant, and the individual package sites are singulated by sawing through the encapsulant and the underlying semiconductor package substrate. Another significant patent is for a "Microelectronic package including a polymer encapsulated die." This invention involves a microelectronic package that includes an integrated circuit die attached to a substrate by solder bump interconnections. The design ensures that the integrated circuit die is properly encapsulated, enhancing its reliability and performance.

Career Highlights

Keith has worked with notable companies such as Motorola Corporation and Freescale Semiconductor, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Keith has collaborated with talented individuals, including James H Knapp and Son Ky Quan. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Keith E Nelson's contributions to semiconductor technology through his patents and career experiences highlight his role as an influential inventor in the field. His work continues to impact the microelectronics industry significantly.