Keith E Daniell

Title: Keith E. Daniell: Innovator in Semiconductor Measurement Technology

Introduction

Keith E. Daniell is a notable inventor based in Norwalk, Connecticut. He has made significant contributions to the field of semiconductor technology, particularly in the measurement of film thickness in multilayer systems. His innovative approach has paved the way for advancements in the manufacturing and quality control of semiconductor devices.

Latest Patents

Daniell holds a patent for a "Method and apparatus for measuring film thickness in multilayer thin films." This patent describes a technique for measuring the thicknesses of a first layer and a second layer on a semiconductor wafer. The method assumes that the second layer has a substantially uniform thickness. By measuring reflectivity as a function of wavelength at multiple points on the wafer, Daniell's technique provides a series of signatures. These signatures are then compared with theoretical libraries to calculate an error value, ultimately determining the minimum error value to identify the thickness of the second layer.

Career Highlights

Throughout his career, Keith E. Daniell has been associated with Integrated Process Equipment Corporation, where he has applied his expertise in semiconductor technology. His work has been instrumental in enhancing the precision of film thickness measurements, which is crucial for the performance of semiconductor devices.

Collaborations

Daniell has collaborated with various professionals in his field, including his coworker Paul J. Clapis. Their combined efforts have contributed to the development of innovative solutions in semiconductor processing.

Conclusion

Keith E. Daniell's contributions to semiconductor measurement technology highlight his role as an inventor dedicated to advancing the industry. His patented methods continue to influence the way film thickness is measured, ensuring improved quality and performance in semiconductor manufacturing.