Keith D Gann

Title: The Innovative Contributions of Keith D. Gann

Introduction

Keith D. Gann is a notable inventor based in Cypress, California, with a remarkable portfolio of 13 patents. His work primarily focuses on advancements in electronic packaging technologies, which have significant implications for the electronics industry.

Latest Patents

Among his latest patents is the "Stackable layer containing ball grid array package." This invention involves layers suitable for stacking in three-dimensional, multi-layer modules, formed by interconnecting a ball grid array electronic package to an interposer layer that routes electronic signals to an access plane. The layers are under-filled and bonded together to create a high-density electronic package. Another significant patent is for "Vertically stacked pre-packaged integrated circuit chips." This innovation allows prepackaged chips, such as memory chips, to be vertically stacked and bonded together with aligned terminals. The bonding wires are exposed on the lateral surface of the stack, and a contact layer is disposed on top to connect the ends of the wires to contact pads.

Career Highlights

Keith has worked with Irvine Sensors Corporation, where he contributed to the development of cutting-edge electronic packaging solutions. His expertise in this field has made him a valuable asset to the companies he has been associated with.

Collaborations

Throughout his career, Keith has collaborated with notable professionals, including W. Eric Boyd and Volkan H. Ozguz. Their combined efforts have led to significant advancements in electronic packaging technologies.

Conclusion

Keith D. Gann's innovative contributions to electronic packaging have established him as a prominent figure in the field. His patents reflect a commitment to advancing technology and improving the efficiency of electronic devices.