This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ebara Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Keita Tanoue: Inventor in Polishing Technology
Introduction
Keita Tanoue is an inventor based in Tokyo, Japan, whose patent work addresses measurement accuracy in substrate polishing. He is associated with Ebara Corporation and has 1 patent listed in the information provided.
Latest Patents
Tanoue’s patent, “Polishing Apparatus,” describes a system designed to improve the accuracy of position coordinates associated with measured film-thickness values. The apparatus combines a pad-thickness measuring device with an optical film-thickness measuring device that directs light obliquely onto a substrate and measures film thickness at selected points.
A controller uses correlation data to determine how polishing-pad thickness affects the measurement coordinates. It then corrects the coordinates associated with the film-thickness measurements, helping improve the accuracy of the recorded measurement positions.
Career Highlights
Tanoue’s listed invention focuses on coordinating polishing-pad thickness measurements with optical film-thickness measurements. This approach is intended to account for coordinate shifts related to pad thickness and refine the positional accuracy of measurement data.
Collaborations
Tanoue’s listed coworkers include Yoichi Shiokawa and Masaki Kinoshita. His company affiliation is Ebara Corporation.
Conclusion
Keita Tanoue’s patent reflects a practical contribution to polishing equipment by addressing the accuracy of film-thickness measurement coordinates.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile