This inventor holds 1 USPTO granted patent. Top assignee: Yazaki Corporation. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Keita Shimakura: Innovator in Circuit Body Technology
Introduction
Keita Shimakura is a notable inventor based in Susono, Japan. He has made significant contributions to the field of circuit body technology. His innovative approach has led to the development of a unique method for forming circuit bodies.
Latest Patents
Keita Shimakura holds 1 patent for his invention titled "Method of forming circuit body and circuit body." This patent describes a process where a conductive portion of a circuit body is formed by spraying on the surface of a resin casing. The method utilizes a cold spray technique, where metal powder and inert gas are applied to the object. A circuit component is then mounted on the conductive portion, which is equipped with connectors for external circuit connections. An insulating resin is laminated on the surface of the conductive portion, allowing for the direct formation of the circuit body on the resin casing.
Career Highlights
Keita Shimakura is currently employed at Yazaki Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing circuit body applications in various electronic devices.
Collaborations
Keita has collaborated with Takuo Matsumoto, a fellow innovator, to enhance the development of circuit technologies. Their combined expertise has contributed to the success of their projects.
Conclusion
Keita Shimakura's contributions to circuit body technology exemplify the spirit of innovation. His patented methods and ongoing work at Yazaki Corporation highlight his commitment to advancing the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile