The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
May. 16, 2019
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Keita Shimakura, Susono, JP;
Takuo Matsumoto, Susono, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 13/16 (2006.01); C23C 24/04 (2006.01); B60R 16/02 (2006.01); H01B 13/012 (2006.01);
U.S. Cl.
CPC ...
C23C 24/04 (2013.01); B60R 16/0207 (2013.01); H01B 13/01209 (2013.01); H01B 13/165 (2013.01);
Abstract
A conductive portion of a circuit body is formed by performing spraying on a surface of a resin casing. For spraying of the conductive portion, a cold spray method in which metal powder and inert gas are sprayed to an object is used. A circuit component is mounted on the conductive portion. Each terminal portion of the conductive portion is provided with a connector for connection with an external circuit body. An insulating resin is laminated on a surface of the conductive portion. The circuit body is directly formed on the surface of the resin casing by a series of processes described above.