Tokyo, Japan

Keisuke Nishu

This inventor holds 1 USPTO granted patent and 3 published patent applications and 1 EPO patent. Top assignee: Cookson Electronics Co.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keisuke Nishu. Retrieved from https://idiyas.com/inventor/keisuke-nishu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: **The Innovative Mind of Keisuke Nishu: Pioneer in Metal Layer Formation**

Introduction

Keisuke Nishu, an accomplished inventor based in Tokyo, Japan, has made significant contributions to the field of materials engineering. With a keen passion for innovation, Nishu has focused on processes that enhance the efficiency and effectiveness of materials used in electronics and other applications. His unique approach has led to the development of a patented process for forming metal layers, showcasing his creativity and technical expertise.

Latest Patents

Nishu holds a patent for a pioneering method titled "Process for forming metal layers." This innovative process involves the formation of a base metal film on the surface of a plastic film through a dry plating process. Following this, a liquid containing an organic monomer is introduced, which selectively creates a conductive organic polymer coating that fills pinhole defects. The final steps include the formation of a metal film over the base metal film through an electroplating process, resulting in a robust metal wet plating layer that provides enhanced conductivity and durability.

Career Highlights

Keisuke Nishu is currently affiliated with Cookson Electronics Co., a company known for its dedication to advancing electronic materials. His work at Cookson focuses on developing cutting-edge technologies that can be utilized across various industries. With one patent to his name, Nishu exemplifies the spirit of innovation that is often necessary in the rapidly evolving landscape of technology.

Collaborations

Throughout his career, Nishu has collaborated with talented coworkers such as Yuichi Kanda and Takashi Abe. These partnerships have allowed for the exchange of ideas and fostered a collaborative environment that enhances the quality of work produced at Cookson Electronics. The synergy within the team has undoubtedly contributed to the success and impact of their innovative projects.

Conclusion

Keisuke Nishu stands out as a forward-thinking inventor in Tokyo, with a notable contribution to the field of material sciences through his patented process for forming metal layers. His dedication to innovation and collaboration with talented professionals sets a strong foundation for future advancements. As technology continues to evolve, Nishu's work will likely play a crucial role in shaping the future of electronic materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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