The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Jun. 16, 2004
Applicants:
Yuichi Kanda, Aizuwakamatsu, JP;
Takashi Abe, Ichikawa, JP;
Atsushi Tanaka, Tokyo, JP;
Keisuke Nishu, Tokyo, JP;
Inventors:
Yuichi Kanda, Aizuwakamatsu, JP;
Takashi Abe, Ichikawa, JP;
Atsushi Tanaka, Tokyo, JP;
Keisuke Nishu, Tokyo, JP;
Assignee:
Cookson Electronics Co., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/36 (2006.01); B05D 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.