Saga, Japan

Keishi Kariya

This inventor holds 1 USPTO granted patent. Top assignee: Tokyo Electron Limited. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keishi Kariya. Retrieved from https://idiyas.com/inventor/keishi-kariya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Keishi Kariya: Innovator in Vacuum Processing Technology

Introduction

Keishi Kariya is a notable inventor based in Saga, Japan. He has made significant contributions to the field of vacuum processing technology. His innovative approach has led to the development of a unique vacuum processing apparatus.

Latest Patents

Kariya holds 1 patent for his invention titled "Vacuum processing apparatus." This apparatus features a heat receiving member designed to absorb heat from a heat source. Additionally, it includes a coolant path that allows coolant to flow, enhancing the efficiency of the heat receiving member.

Career Highlights

Kariya is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing equipment industry. His work focuses on advancing technologies that improve processing efficiency and reliability in vacuum environments.

Collaborations

Throughout his career, Kariya has collaborated with talented individuals such as Akio Miyara and Yun Mo. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Keishi Kariya's contributions to vacuum processing technology exemplify his dedication to innovation. His patent and work at Tokyo Electron Limited highlight his role as a key figure in advancing this important field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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