Otsu, Japan

Keiko Suda

This inventor holds 1 USPTO granted patent. Top assignee: Toray Engineering Company, Limited. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiko Suda. Retrieved from https://idiyas.com/inventor/keiko-suda-kb81dger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Keiko Suda

Introduction

Keiko Suda is a prominent inventor based in Otsu, Japan. She has made significant strides in the field of additive manufacturing, particularly in predicting the strength of structures. Her innovative approach has garnered attention in the engineering community.

Latest Patents

Keiko Suda holds a patent for a method that predicts the strength of structures modeled by additive manufacturing techniques. This patent includes a comprehensive method for acquiring material layering information, such as scanning direction and layering pitch. By factoring in strength anisotropy attributable to the material layering method, her invention enhances the reliability of additive manufacturing processes. She has 1 patent to her name.

Career Highlights

Keiko Suda is currently employed at Toray Engineering Company, Limited, where she applies her expertise in engineering and materials science. Her work focuses on advancing technologies that improve the performance and safety of manufactured structures.

Collaborations

Keiko collaborates with Takamitsu Yamada, a fellow engineer, to further explore innovative solutions in their field. Their partnership exemplifies the importance of teamwork in driving technological advancements.

Conclusion

Keiko Suda's contributions to the field of additive manufacturing and her innovative patent demonstrate her commitment to enhancing engineering practices. Her work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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