Keiichi Kondo

Title: Keiichi Kondo: Innovator in Molding Technologies

Introduction

Keiichi Kondo is a notable inventor based in Fukui, Japan, recognized for his contributions to molding technologies. With a total of seven patents to his name, Kondo has made significant advancements in the field of composite materials and automated lamination processes.

Latest Patents

One of Kondo's latest patents is a molding method and molding device for composite sheets. This innovative method is designed for manufacturing thermosetting resin prepreg sheets. It involves bringing a resin transfer sheet, which carries a thermosetting resin material, into contact with a fiber sheet. The stacked sheets undergo heating and pressurizing treatments, followed by cooling treatments to ensure the resin adheres to the fiber sheet effectively.

Another significant patent is the thin-layer tape automated lamination method and device. This invention aims to enhance the efficiency of automated lamination using thin-layer tapes. The device includes a provisional formation unit that creates lamination tapes of varying thicknesses and a lamination-shaping unit that shapes these tapes on a basal body surface.

Career Highlights

Throughout his career, Keiichi Kondo has worked with esteemed organizations, including the Fukui Prefectural Government and Honda Motor Co., Ltd. His experience in these companies has contributed to his expertise in molding technologies and innovation.

Collaborations

Kondo has collaborated with notable colleagues such as Kazumasa Kawabe and Hirofumi Iyo. These partnerships have likely fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Keiichi Kondo's work in molding technologies and automated lamination has positioned him as a significant figure in the field of innovation. His patents reflect a commitment to advancing manufacturing processes and materials science.