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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9895867 B1

PDFFull Text
Date of Patent:
Feb. 20, 2018

Filed:

Mar. 18, 2014

Laminated molded body

Applicant:

Fukui Prefectural Government, Fukui-shi, Fukui, JP;

Inventors:

Kazumasa Kawabe, Fukui, JP;

Hideki Sasayama, Fukui, JP;

Keiichi Kondo, Fukui, JP;

Assignee:

FUKUI PREFECTURAL GOVERNMENT, Fukui-shi, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Bijan Ahvazi

Assistant Examiner:

Thuy-Ai N Nguyen

Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 9/04 (2006.01); B32B 17/06 (2006.01); C08J 5/24 (2006.01); B32B 5/26 (2006.01); B32B 27/12 (2006.01); B32B 27/18 (2006.01); B32B 27/38 (2006.01); B32B 27/20 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 5/26 (2013.01); B32B 27/12 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); C08J 5/24 (2013.01); B32B 2250/05 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2264/0264 (2013.01); B32B 2305/08 (2013.01); B32B 2307/514 (2013.01); B32B 2307/54 (2013.01); B32B 2307/552 (2013.01); B32B 2307/558 (2013.01);
Abstract

The present invention has an object to provide a laminated molded body in which a thin fiber reinforced layer is laminated and having a favorable strength characteristic. The laminated molded body () includes a laminated portion (a laminated portion of SRon an upper side and SR, for example) in which fiber reinforced layers SRto SR, each having a thickness of 20 to 80 μm in which a reinforcing fiber material is dispersed in a thermosetting resin material which serves as a matrix, are laminated, and a laminated portion in which a resin layer is laminated between the fiber reinforced layers (a laminated portion of SRon the upper side, TP, and SR, for example).

Find Patent Forward Citations

Kawabe, Kazumasa. (2018). Laminated molded body (U.S. Patent No. 9895867). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9895867

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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